Senior Staff Engineer: Advanced Packaging - Menlo Park - pacb

+Job summary · In this role you'll work to shape the future of AI/ML hardware acceleration + · +Develop next-generation packaging breakthroughs and qualify high-performance foundry solutions. · Drive the development of advanced test macro features and execute engineering plans fo ...

In this role, you'll work to shape the future of AI/ML hardware acceleration. · You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. · ...

We're looking for an experienced packaging engineer to join our team at Google. In this role, you'll work on shaping the future of AI/ML hardware acceleration by driving cutting-edge TPU technology. · ...

Shape the future of AI/ML hardware acceleration and contribute to the innovation behind products loved by millions worldwide. · Develop advanced packaging solutions for ML chips. · Collaborate with architects to create high-performance packages optimized for electrical performanc ...

We are seeking an experienced engineer to lead the development of advanced packaging technologies that enable next-generation, high-performance compute systems.This role sits at the intersection of chip architecture, package integration, and manufacturing scale-up. · ...

We are seeking an experienced engineer to lead the development of advanced packaging technologies that enable next-generation, high-performance compute systems. · Architect, develop, and prototype advanced packaging solutions (2.5D/3D integration, large-format interposers/bridges ...

MediaTech is seeking a talented and experienced technical leader with expertise in Packaging Architect. · This role involves close collaboration with cross-functional teams. · ...

About the role involves close collaboration with cross-functional teams to develop innovative packaging solutions for automotive and computing applications. · ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.  · At Marvell, you can aff ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · Collaborate with IC design teams to support package planning and substrate design. · Build and correlate SI/PI models for advanced interconnec ...

About The Team · OpenAI's Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research par ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solu ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solu ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. · ...

We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. · Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor package ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America.We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakth ...

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. · In this role, you'll contribute to the advanced packaging technologi ...

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, · advanced custom package solutions achieving ...

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a · 6-month period. · We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicat ...

To advance the world's technology together as a senior technologist at Samsung Semiconductor you will have an opportunity to serve as the primary technical bridge between our strategic customers and internal engineering teams. · Lead customer technical engagement by serving as th ...

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. · ...