- Support the design and development of complex mechanical, electronic packaging and electro-mechanical designs and execute layouts for multiple large scale radar products.
- Develop solutions for packaging of electrical components such as Circuit Cards, Connectors, and cables, including design, integration and validation in rugged environments. responsible for following standard MEP design practices including relevant internal and program design reviews prior to the release of the design in the product data management tool.
- Work closely with cross-functional teams including Designers, Thermal/Structural Analysts, Systems Engineers, as well as other engineering disciplines as well as Operations, Procurement, Quality, Program Managers, and customer counterparts in the development of new designs and releasing to production.
- Perform and guide analyses including thermal analysis of large cooling systems down to the printed circuit assembly level, as well as fluid, structural (static, vibration and shock), and power.
- Responsible for developing, integrating, and validating new designs including prototyping, testing, and troubleshooting of the new products as they are released for full scale production. This will also include the development and implementation of test protocols for both informal and formal design testing as well as the support of manufacturing work instruction documentation as needed by the Production manufacturing engineering team.
- Support proposal technical content for bids: scope capture, requirements development, materials pricing, and labor estimates as required.
- May lead, train, and mentor junior engineers.
- Requires comprehensive level knowledge of job area. May have in-depth knowledge of project management. Bachelor's Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.
- Demonstrated experience in solving electronic packaging trades involving Printed Board assembly (PCB) and Circuit Card Assembly (CCA) designs under enviromental conditions.
- Experience with MIL Standards including but not limited to 810, 461 and a host of material, plating and electronics packaing assembly MIL standards
- Demonstrated CAD experience, PTC CREO/Windchill
- Demonstrated structural analysis experience in ANSYS
- Demonstrated experience with standard ASME Y14.5M-1994 and GD&T
- Proficiency in MS Office suite
- Ability to obtain and maintain a security clearance
- Experience with large radar motor and transmission systems
- Experience with machined, plastic and sheet metal part design
- Design for Manufacturability and Assembly (DFM/DFMA) experience
- Experience with PDM
- Experience with Earned Value Management cost and schedule practices
- Experience with Project Management A wide degree of creativity and latitude is expected, including the ability to multi-task in an environment with changing priorities
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Lead, Mechanical Engineer - Lancaster, United States - L3Harris
Description
Job Title: Lead, Mechanical Engineering
Job Code: 11090
Job Location: Van Nuys, CA
Job Description:
Seeking an Electronic Packaging / Mechanical Engineer to work with a cross-functional team to develop Electronic Packaging systems, following the product from conceptualization through hardware integration and testing. The position will require performing the mechanical engineering activities related to the design, analysis, documentation, processing, fabrication, assembly and qualification of product to the specification requirements with technical, schedule, and process requirements. provide legacy design production engineering support to address root cause and corrective action evaluation and make recommended design updates as requirements change to ensure the product maintains production schedule.
Essential Functions:
Qualifications:
Preferred Additional Skills:
In compliance with pay transparency requirements, the salary range for this role is $117,000- $218,000. This is not a guarantee of compensation or salary, as final offer amount may vary based on factors including but not limited to experience and geographic location. L3Harris also offers a variety of benefits, including health and disability insurance, 401(k) match, flexible spending accounts, EAP, education assistance, parental leave, paid time off, and company-paid holidays. The specific programs and options available to an employee may vary depending on date of hire, schedule type, and the applicability of collective bargaining agreements.
L3Harris Technologies is proud to be an Affirmative Action/Equal Opportunity Employer. L3Harris is committed to treating all employees and applicants for employment with respect and dignity and maintaining a workplace that is free from unlawful discrimination. All applicants will be considered for employment without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender (including pregnancy, childbirth, breastfeeding or other related medical conditions), gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status, characteristic or membership in any other group protected by federal, state or local laws. L3Harris maintains a drug-free workplace and performs pre-employment substance abuse testing and background checks, where permitted by law.
