RF Module Engineer IV - Sunnyvale, United States - Ursus Inc

Description

• 5+ years of experience in developing RF modules/SIPs, preferable in wireless consumer electronics or similar industries
• MS or PhD in EE with emphasis on advanced packaging or RF design
• Experience in RF design and RF advanced packaging technologies

• Own end-to-end RF module/SIP development for our client's products from concept to mass production.
• Responsible for module/SIP technology selection, part selection, vendor evaluation, contract development, and performing cost/technology/performance analysis.
• Develop module architecture, schematics, and layouts, and work with vendors for DFM and manufacturing.
• Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of RF modules/SIPs.
• Design, simulate and validate advanced RF packaging/module/SIP
• Collaborate closely with cross-functional teams and vendors to ensure RF performance is met at component, board, and system levels.
• Evaluate new advanced packaging technology, including design and validation of prototypes.
• Domestic/international travel to achieve program milestones.

• 3+ years of experience in developing RF modules/SIPs, preferable in wireless consumer electronics or similar industries.
• t least BSEE or BSc in related engineering discipline
• Experience with advanced packaging technologies and RF module/SIP design
• Experience in RF schematics, layouts, and DFM.
• Work experience with RF lab equipment for device characterization, debug, and component/system performance validation.
• Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
• Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g. network analyzers, communication testers, spectrum analyzers, and oscilloscopes)
• Good communicator and team player.

• MS or PhD in EE with emphasis on advanced packaging or RF design
• 5+ years of relevant industry experience
• Experience in RF design and RF advanced packaging technologies.
• Experience with WiFi, BT, GPS, and cellular RF implementation.
• Experience in bringing RF modules/SIPs to production
• Familiar with regulatory requirements (FCC, CE, etc.).