Package Engineering - Sunnyvale, CA, United States - Mastech Digital, Inc.

Description

Mastech Digital provides digital and mainstream technology staff as well as Digital Transformation Services for all American Corporations. We are currently seeking a RF/mmWave Packaging Engineer for our client in the Consulting domain. We value our professionals, providing comprehensive benefits and the opportunity for growth. This is a Permanent position, and the client is looking for someone to start immediately.


Duration:
Full-time


Location:
Sunnyvale, CA


Salary:
$130K-$192K/Annually or $65-$90/Hourly

Role:
RF/mmWave Packaging Engineer


Primary Skills:
RF/mmWave


Role Description:
The RF/mmWave Packaging Engineer must have at least 3+ years of experience.


Responsibilities:

• Design, simulate and validate advanced RF/mmWave packaging/module solutions.
• Liaise with OSAT vendors for manufacturing.
• Design, simulate and validate Integrated passive device (IPD).
• Liaise with foundry for tapeout.
• Design PCB schematic, layout and perform circuit and 3D EM simulation.
• RF lab debug, tuning, performance optimization and validation.

Required Skills:

• 3+ years of experience in developing RF/mmWave packages and IPD design.
• In depth knowledge in electromagnetics, RF filters, PA and LNA design.
• Experience with foundry tapeout and working with OSAT vendors.
• Experience in RF schematics, layouts, and DFM.
• Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
• Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
• Good communicator and team player.

Education:

• MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design

Preferred Skills:

• 5+ years of relevant industry experience
• Familiar with RF system design.
• Familiar with regulatory requirements (FCC, CE, etc.).

Education:
MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelor's degree in Computer Science, Electrical/Electronic Engineering, Information Technology or another related field or Equivalent

Experience:
Minimum 3+ years of experience

Relocation:
This position will not cover relocation expenses


Travel:
No


Local Preferred:
Yes


Note:
Must be able to work on a W2 basis (No C2C)

Recruiter Name:
Haris Khan


Recruiter Phone:
Equal Employment Opportunity