IC Package Design Engineer - Santa Clara

Only for registered members Santa Clara, United States

2 weeks ago

Default job background
$139,500 - $258,100 (USD)

Job summary

We believe new insights have a way of becoming extraordinary products services and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish.

Familiarity with various sophisticated package configurations and assembly/ substrate technology wirebond POP etc., Experience in package design proficient in Cadence Allegro platform tools PCB Editor Advanced Package Designer APD/SiP or Mentor Xpedition platform tools Basic understanding some SI/PI tools XtractIM PowerSI HFSS Q3D etc., Proven fundamentals electrical/material/thermal/ or mechanical engineering field(s).

In this highly visible role you will own drive sophisticated package selection new generation product package structure configuration optimization You will be responsible for Packages SIP/module physical design layout optimization DV tape out work multi-functional teams achieve optimized mechanical/electrical/ thermal performance for various types of chips Implement the physical design packages modules SoC Memory RF cellular chips Interface coordinate multi-functional groups throughout Apple on product packages SiP feasibility analysis selection Define develop verification automation strategy strengthen streamline package release flows Work optimize pin out Perform extraction S-parameters RLGC model Ensure is optimized SI PI requirements Drive methodology innovations efficiency improvements together vendors developers feature development bug resolution Explore evaluate develop CAD tool flow Partner Silicon PD team optimize chip Floorplan bump placement minimize size Preferred Qualifications As IC Package Design Engineer demonstrate fundamental knowledge proven experience following Proven in electrical material thermal mechanical engineering field(s) Familiarity sophisticated configuration assembly substrate technology wirebond POP etc. Experience packaging proficient Cadence Allegro platform tools PCB Editor APD/SiP Mentor Xpedition platform tools Basic understanding some SI PI toolsknowledge high-speed interfaces including DDR PCIe NAND EMI RFI PCB resonance Solid of Design Rules Check Manufacturing.

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