Director, Product Line Manager – Advanced Packaging - Milpitas

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · Collaborate with IC design teams to support package planning and substrate design. · Build and correlate SI/PI models for advanced interconnec ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.  · At Marvell, you can aff ...

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, · advanced custom package solutions achieving ...

MediaTech is seeking a talented and experienced technical leader with expertise in Packaging Architect. · This role involves close collaboration with cross-functional teams. · ...

About the role involves close collaboration with cross-functional teams to develop innovative packaging solutions for automotive and computing applications. · ...

Technician job description:Perform fiber fusion splicing and operate optical test equipment, including OBR and related measurement instruments, ensuring all process steps are executed in accordance with established work instructions. · Operate active alignment equipment, followin ...

We're looking for an experienced packaging engineer to join our team at Google. In this role, you'll work on shaping the future of AI/ML hardware acceleration by driving cutting-edge TPU technology. · ...

About Eridu · Eridu is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers to deliver · Faster AI · . Today's AI performance is frequently limited by communication bottlenecks. Eridu introduces multiple industry-first innova ...

+Job summary · In this role you'll work to shape the future of AI/ML hardware acceleration + · +Develop next-generation packaging breakthroughs and qualify high-performance foundry solutions. · Drive the development of advanced test macro features and execute engineering plans fo ...

In this role, you'll work to shape the future of AI/ML hardware acceleration. · You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. · ...

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver indust ...

Shape the future of AI/ML hardware acceleration and contribute to the innovation behind products loved by millions worldwide. · Develop advanced packaging solutions for ML chips. · Collaborate with architects to create high-performance packages optimized for electrical performanc ...

Company Overview · KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, ...

Who We Are · Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chip ...

We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. · Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor package ...

Who We Are · Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chip ...

+who we areapplied materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world as the foundation of the global electronics industry applied enables the exciting technologies that literally connect our ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solu ...

Company Overview · KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, ...

· Job Title: Advanced Package Design Engineer · Office Location: San Jose, CA · Work Model: Onsite · About SK hynix America · At SK hynix America, we're at the forefront of semiconductor innovation, developing advanced memory solutions that power everything from smartphones to d ...