Director, Product Line Manager – Advanced Packaging - Milpitas

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, · advanced custom package solutions achieving ...

Job summary Join Marvell's central packaging organization responsible for enabling next‑generation connectivity and compute products. You'll contribute to the design, modeling, and validation of advanced IC packages supporting high‑speed interfaces. Your work in SI/PI will direc ...

MediaTech is seeking a talented and experienced technical leader with expertise in Packaging Architect. · This role involves close collaboration with cross-functional teams. · ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · Collaborate with IC design teams to support package planning and substrate design. · Build and correlate SI/PI models for advanced interconnec ...

About the role involves close collaboration with cross-functional teams to develop innovative packaging solutions for automotive and computing applications. · ...

In this role, you'll work to shape the future of AI/ML hardware acceleration. · You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. · ...

+Job summary · In this role you'll work to shape the future of AI/ML hardware acceleration + · +Develop next-generation packaging breakthroughs and qualify high-performance foundry solutions. · Drive the development of advanced test macro features and execute engineering plans fo ...

We're looking for an experienced packaging engineer to join our team at Google. In this role, you'll work on shaping the future of AI/ML hardware acceleration by driving cutting-edge TPU technology. · ...

Shape the future of AI/ML hardware acceleration and contribute to the innovation behind products loved by millions worldwide. · Develop advanced packaging solutions for ML chips. · Collaborate with architects to create high-performance packages optimized for electrical performanc ...

The Product Line Manager (PLM) for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next-generation semiconductor packaging and metrology solutions. · ...

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. · ...

+who we areapplied materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world as the foundation of the global electronics industry applied enables the exciting technologies that literally connect our ...

We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. · Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor package ...

The Product Line Manager (PLM) Director for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next-generation semiconductor packaging and metrology solutions. · ...

Serve as the primary technical bridge between our strategic customers and our internal engineering teams. · ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America.We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakth ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. · ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. · ...

To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a · 6-month period. · We believe innovation and growth are driven by an inclusive culture and a diverse workforce. We're dedicat ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solu ...