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    NM DMO Plating Development Engineer - Edgewood, United States - INTEL Careers

    INTEL Careers
    INTEL Careers Edgewood, United States

    2 weeks ago

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    Description
    Job Description Experienced Development Engineer capable of developing Plating processes to meet the needs of next generation semiconductor devices. Defines and implements processes related to e-test, film thickness and layer performance criteria for production. Collaborate with diverse teams to setup Plate processes meeting integration needs. Technical owner of consumable characterization data methodology, analysis techniques, and recipe setup for quality control to optimize yield. Defines and implements Plate roadmaps, quality control, failure analysis, and testing methodologies to meet customer demands.

    Development Engineers are responsible for leading process development research enabling manufacture of innovative device architectures coupled with the realization of these architectures.

    They will design, execute, and analyze experiments necessary to meet design specifications for their process.


    Participate in development of intellectual property and develop the equipment necessary to exploit the understanding gained in research (in collaboration with equipment suppliers).

    Work effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.


    They will be expected to partner with area engineers, technicians, integration, SGL, and management to enable develop commitments for their aligned tech node.


    Work to gain in-depth knowledge of their materials, process, and equipment to meet quality, reliability, cost, yields, and product development timelines.

    Define High Volume Manufacturing transfer deliverables for their module.

    Partner with Process Integrators to develop recipes for new product demands.


    Required Skills:
    Consumable screening and initial Best Known Method creation.

    Processing techniques, materials, and metrology relevant to Plating.


    Willingness to work independently with limited direction, as well as in a team environment across functional and organizational boundaries is required.

    Experience with material characterization techniques.

    Development of novel process recipes.


    Drive improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment, and operating personnel.

    Define and establish flow, procedures, and equipment configuration for the module.

    Train production/receiving process engineers, engineering, and manufacturing technicians for transfer to other factories.


    Transfer process to High Volume Manufacturing and provide support in new factory startup as well as install and qualification of the new production lines.

    Experience in data analysis and statistical process control.

    Strong written and verbal communication. Ability to communicate well with all levels of the organization.

    Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals.


    Demonstrated capability working in a high performing team culture which include: excellent teamwork and leadership skills, demonstrated problem solving and prioritization skills, and participating in Continuous Improvements through applying LEAN principles.

    Relocation assistance provided.
    Qualifications You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.


    Minimum Qualifications:


    BS, MS with 5+ years or PhD degree with 2+ years of experience in semiconductor industry in Physics, Electrical Engineering, Chemical Engineering or related fields.

    2+ years of experience in development and design of Plate processes.


    Inside this Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.

    Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

    Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

    Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. Working Model This role will require an on-site presence.


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