No more applications are being accepted for this job
- By delivering ultra-high performance and energy efficiency, Lightmatter's compute engine will power rapid advancements in AI while lowering its environmental footprint.
- You will be working within the packaging team to carry out required structural analysis for packaging technologies under consideration; identify key failure modes under product use conditions, run appropriate parametric studies to influence product and package design upstream.
- Develop finite element analysis models for wafer and assembly processes to predict stress, warpage, temperature.
- Perform system level finite element modeling to predict loads and responses under dynamic shock and vibration conditions
- Perform multi-physics simulations such as solder collapse based modeling to define bump architecture or thermal-structural analysis for packaging stress.
- 3-6 years of experience in finite element analysis techniques and relevant coursework.
- Proficiency in use of analysis tools such as ANSYS/ABAQUS Structures and design tools such as Solidworks, AutoCAD
- Direct experience applying finite element methods to microelectronics packaging and system level compute hardware
Thermo - Mechanical Engineer - Mountain View, United States - Lightmatter
