Principal IC Packaging Engineer - San Diego, CA
3 weeks ago

Job summary
We are seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies.This role focuses on spearheading new product introductions for cutting-edge package technologies,
particularly targeting Data Center AI, Power Management, and emerging markets.
The engineer will drive innovation from initial concept through to high-volume manufacturing (HVM)
at assembly suppliers.
- Provide leadership and take responsibility for the development of advanced packaging technologies.
- Oversee new product introductions and ensure smooth transition to high-volume manufacturing.
- Leverage subject matter expertise in package architecture,
Job description
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