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- is a rapidly growing startup company that has developed breakthrough technology in ultrasound imaging.
- Not only do we offer a great team-oriented environment, but we also offer competitive compensation of $75K to $200K per year and generous benefits in both our Clayton, MO (a suburb of St. Louis) and Santa Clara, CA offices.
- In photonics, the packaging design is as crucial as the photonic integrated circuit (PIC) design.
- You will be also involved in integrating photonics components with other modules in the system.
- This position will be looking for someone who can design, develop, and validate a low-cost, high-performance, and reliable packaging platform for photonics components and system integration.
- BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or similar)
- 5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips.
- Experience with 3D printing and/or CNC machining is preferred