Product Yield Enhancement Engineer, HBM - Boise, ID

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, · inspiring the world to learn, communicate and advance faster than ever. · We offer a choice of medical, dental and vision plans in ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · We offer a choice of medical, dental and vision plans enabling team members to select the plans that best meet their family health ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · Perform Electrical Failure Analysis and Fault Isolation using methods such as emission, laser techniques, and EOTPR · Characterize ...

Micron Technology is a world leader in innovating memory and storage solutions. As a Product Yield Enhancement (PYE) High Bandwidth Memory (HBM) Electrical Failure Analysis (EFA) Engineer, you will work with a team responsible for taking next generation HBM devices from design to ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

Own package-level process integration across 2.5D/3D flows wafer-to-wafer chip-to-wafer advanced interconnects defining specs and process windows that meet high performance targets for HPC/AI products · ...

Micron Technology es una líder mundial en innovar soluciones de memoria y almacenamiento que aceleran la transformación de la información en inteligencia. · ...

Collaborate with engineering manufacturing and leadership to design and deliver technical training programs Conduct needs assessments to identify short- and long-term training requirements across the global TPG organization Develop and maintain engaging course content supporting ...

The Customer Integration Lead (CIL) is a technical and customer-facing role within the CETL organization. This position focuses on enabling multi-functional collaboration, · Technical expertise on HBM systems, product architecture, manufacturing steps, · Analyze customer require ...

+Develop next-generation High Bandwidth Memory products targeting automotive market. · +Work as key interface between Design, Manufacturing, Test, Quality departments. · Program programming languages (C). · ...

Micron Technology is seeking an MTS Process Integration Engineer for its Advanced Packaging Technology Development (APTD) department. The ideal candidate will own the end-to-end integration of next generation package architectures like 2.5D, 3D stacking, HBM memory integration an ...

We are transforming how the world uses information to enrich life for all. · Micron Technology is a world leader in innovating memory and storage solutions that accelerate transformation of information into intelligence, · inspiring faster learning communication advancement than ...

Are you passionate about empowering technical teams through impactful training and development? Join our dynamic Technology & Products (TPG) organization as a Workforce Development Engineer. · ...

We are seeking a Staff DRAM Product Applications Engineer to be a liaison between engineering teams and customers, focusing on validation, characterization, and integration of DRAM components. · ...

We are seeking a Staff DRAM Product Applications Engineer to join our team at Micron Technology. As a liaison between engineering teams and customers, you will focus on validation, characterization, and integration of DRAM components. You will lead product definition, quality imp ...

We are seeking a Wafer Probe Integration Engineer to join our team at Micron Technology. · Micron is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, · inspiring the world to learn, communicate and adva ...

We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like HBM, RDIMM/LRDIMM and CAMM modules graphics GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical req ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

Join Micron's elite CMOS Device Integration Team and lead the development of next-generation devices powering groundbreaking DRAM and Compute-in-Memory solutions. · PhD or Master's in Electrical Engineering (or equivalent) with advanced CMOS experience; DRAM expertise is a plus. ...