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    Custom IC Design Engineer - Tukwila, United States - Boeing

    Boeing
    Boeing Tukwila, United States

    3 weeks ago

    BOEING background
    Description
    Custom IC Design Engineer (Associate, Mid-Level, Senior)


    Company:
    The Boeing Company


    Job ID:

    Date Posted:

    Location:
    USA - Tukwila, WA


    Job Description Qualifications:
    Currently SSED is actively hiring

    Custom Integrated Circuit Design Engineers (Associate, Mid-Level, Senior),

    who have expertise and/or course work in standard cell design, analysis, verification and test.

    The Custom Integrated Circuit (IC) Design Engineer is expected to contribute all phases of design and development from requirement definition, initial concepts, and architecture and trade studies; through behavioral modeling, circuit design and layout implementation.

    As well as ability to define test plans and supply testing of the chips in a lab. This position will be based out of

    Tukwila, Washington .


    We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.

    We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future #TheFutureIsBuiltHere #ChangeTheWorld

    Within BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development for aerospace systems.

    SSED develops digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic functions.

    These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state-of-the-art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe.

    SSED uses external wafer fabrication services but executes the whole design flow in-house (architecture definition, circuit design, RTL, synthesis, physical layout, verification, packaging and testing).

    SSED owns numerous microelectronics projects, funded both by internal Boeing programs and external U.S. Government Science and Technology (S&T) customers. SSED's large staff of microelectronics engineers conducts research and designs microelectronics hardware in support of these projects.


    SSED executes a variety of exciting, technically challenging projects, offering endless opportunities to develop depth and breadth of technical skills.

    We offer on-the-job learning opportunities and long-term potential for career growth into both technical leadership and/or management positions and seek curiosity, creativity, innovation, attention to detail, clear communication, and the ability to understand and meet customer needs.


    Position Responsibilities:
    Perform full-custom IC design
    Develop standard cells incorporating structured, pitched, or arrayed layout
    Perform custom and standard cell-based floor-planning and hierarchical layout assembly
    Manage IR drop, RC delay, electro migration, self-heating and coupling capacitance
    Perform physical verification including DRC, LVS, and ERC
    Perform parasitic extraction and analysis.
    Perform component level layout up to top-level chip assembly in advanced technologies (e.g. FinFET).
    Drive top-level chip integration and release prototype and production IC's to fabrication
    Drive continued improvement of layout practices and procedure
    Communicate effectively with a cross-functional team, including written and verbal communication of requirements and responsibilities in all platforms
    Utilize industry standard EDA tools from Cadence, Mentor, and Synopsys
    Perform analog and high-power layout techniques
    Exercise and debug the IC verification flow (DRC, LVS, XOR, PEX, etc.)
    Design Mixed-Signal IC macro sub-circuits from specification to tape out
    Design specialized circuits for extreme temperatures, harsh radiation environments, ultra-low-power and low-area solutions.
    Document circuit designs for design traceability and testing enablement
    Test and characterize circuits in a laboratory environment
    (For P3- P4 and higher) Lead and mentor Junior Engineers
    This position is expected to be 100% onsite. The selected candidate will be required to work onsite at one of the listed location options.

    This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship.

    An interim and/or final U.S. Secret clearance Post-Start is required.

    Basic Qualifications (Required Skills/Experience):

    Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science
    Experience with standard cell development and/or familiarity with structured, pitched, or arrayed layout
    Experience with Electronic Design Automation (EDA) tools and methodologies for Custom or Analog/Mixed-Signal design
    Experience with layout techniques for managing IR drop, RC delay, electromigration, self-heating and coupling capacitance

    Preferred Qualifications (Desired Skills/Experience):

    3+ years of related work experience or an equivalent combination of education and experience
    5+ years of related work experience or an equivalent combination of education and experience
    Familiarity with P-cell design
    Basic understanding of deep submicron device physics
    Proven ability to derive requirements and complying with specifications in circuits and systems

    Greater than the minimum level of design experience in Analog, Digital, Mixed-Signal, RF domains, or experience designing and/or testing chips in more than one domain.

    Experience bringing up a Product Design Kit (PDK) in a modern state-of-the-art process technology (FinFET or GAA FET)
    Experience with commercial Cadence tools (Virtuoso suite and Spectre simulator products)
    Experience working on large-scale SoC design teams.
    Experience developing Analog/Mixed-Signal circuits in state-of-the-art semiconductor fabrication processes (e.g. 7/10/12/14/16nm FinFET CMOS, 22nm FDSOI CMOS, BiCMOS)
    Experience developing Analog/Mixed-Signal ICs for extreme environment applications (e.g. radiation-hardened, extreme low/high temperatures, ultra-long lifetime)
    Demonstrated track record as a high-performance team member
    Excellent verbal and written communication ability
    Active security clearance
    Must be able to recognize failure prone circuit and layout structures, have experience in applying DFM best practices, and proactively work with circuit designers to identify the best approach to solving problems
    High level of proficiency in interpretation of CALIBRE DRC, ERC, LVS, etc. reports.
    Scripting skills in PERL or SKILL

    Typical Education/Experience:
    Associate (Level 2)

    Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g.

    Bachelor) and typically 2 or more years' related work experience or an equivalent combination of technical education and experience (e.g.

    Master). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

    Mid-Level (Level 3)

    Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g.

    Bachelor) and typically 5 or more years' related work experience or an equivalent combination of technical education and experience (e.g.

    PhD, Master+3 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

    Senior (Level 4)

    Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g.

    Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g.

    PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.


    Relocation:
    This position offers relocation based on candidate eligibility.


    Drug Free Workplace:


    Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.


    Shift Work Statement:
    This position is for 1st shift.


    Union:
    This is a union represented position.

    At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.


    The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.


    The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

    Pay is based upon candidate experience and qualifications, as well as market and business considerations.

    Summary pay range Associate Level:
    $85,850 - $116,150

    Summary pay range Mid-Level:
    $104,550 - $141,450

    Summary pay range Senior Level:
    $126,650 - $171,350

    Applications for this position will be accepted until May 28th, 2024

    Boeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians. Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.


    Relocation:
    Relocation is available for eligible candidates, if authorized


    Export Control Requirement:
    U

    S Government Export Control Status:
    This position must meet export control compliance requirements. To meet export control compliance requirements, a "U.S. Person" as defined by 22 C.F.R. §120.15 is required. "U.S. Person" includes U.S. Citizen, lawful permanent resident, refugee, or asylee.


    Safety Sensitive:
    This is not a safety sensitive position

    Contingent Upon Award Program
    This position is not contingent upon program award


    Experience Level:
    Individual Contributor - 2


    Job Type:
    Regular


    Job Code:
    6B1DI2 (64Y)


    Equal Employment Opportunity:


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    Boeing is an Equal Opportunity Employer.

    Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.

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