- Responsibilities include driving GF's industry leading Photonix platform growth, product and module reliability, packaging design rules, materials selection criteria and definition of electrical stress plans for chiplet and product module qualification.
advanced packaging engineer - photonic interconnects - Ballston Spa - beBeeElectroOptics
Job title: DMTS SiPh Packaging
Description
The ideal candidate will have expertise in photonic and electronic package architecture definition as well as broad knowledge of global technology trends related to current technologies. Experience in bringing packaged products from development into production for data centers, automotive and communications industries is essential.