Sr. Process Engineer - Orange, United States - Summit Interconnect

Description

Job DescriptionJob Description

Summit Orange currently has an open position for a Sr. Process Engineer. Summit Interconnect is a manufacturer of advanced technology printed circuit boards with a specific focus on complex rigid and rigid-flex product with unique expertise in RF/Microwave applications.

The Sr. Process Engineer will be responsible for operational excellence via effective manufacturing design. Ensures continuous improvement in process, cost, quality and production.

Qualifications: To perform this job successfully, an individual must have a minimum of ten (10) years in the printed circuit board industry and must be able to perform each essential duty satisfactory. The requirements listed below are representative of the knowledge, skill and/or ability required.

Responsibilities:

• Provide technical support to manufacturing as required.
• Oversee projects and meet realistic goals set forth by the Process Engineering Manager. This is a "hands on" position.
• Develop and document processes and controls as directed by the Process Engineering Manager.
• Establish test methods, perform evaluations, and analyze results to assess existing and future technologies, products, and services.
• Perform tasks and implement processes & procedures assigned by management.
• Provide technical input and informed judgment to the disposition of discrepant material/ product.
• Participate in the Mentor program to promote employee development and growth.
• Monitor and evaluate the performance, efficiency, and effectiveness of established processes and procedures.

General Performance Criteria:

• Process and product yields.
• Process control implementation.
• Effectiveness of line support.
• Accuracy of all procedures.
• Effectiveness in solving process problems.
• Communication and documentation of process activities.
• Amount of continuous improvement achieved.

Education/Qualifications:

• Four Year Degree in Engineering or Science field preferred.
• Minimum ten (10) years' experience in printed circuit board processes.
• Broad based experience in all aspects of multilayer PWB manufacturing.
• Ability to recognize and assess process technology requirements and develop strategic plans for integration.
• Excellent oral and written skills.
• Ability to interface in a positive manner with co-workers at all levels.

Compensation/Benefits: Summit offers a variety of health and benefit programs. Which include Medical, Dental, Vision, HSA plans, Hospital and Accident plans, Life Insurance, PTO, and Paid Holidays. Benefits are effective 1st day of the month following date of hire.

Pay Range for this position is $110, $120,000.00 annually based on experience.

Summit Interconnect is an Equal Opportunity/Affirmative Action Employer

Company DescriptionSummit Interconnect is the global standard in printed circuit board manufacturing. Our advanced capabilities and exceptional reputation to fabricate complex multi-layer designs have made us innovators in the PCB industry.

Our state-of-the-art printed circuit boards meet stringent quality standards and design specifications. Our commitment to innovative ideas and high standards allow us to provide our customers with the quality and reliability needed for the most advanced circuit board designs found in the industry today.Company DescriptionSummit Interconnect is the global standard in printed circuit board manufacturing. Our advanced capabilities and exceptional reputation to fabricate complex multi-layer designs have made us innovators in the PCB industry. \r
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Our state-of-the-art printed circuit boards meet stringent quality standards and design specifications. Our commitment to innovative ideas and high standards allow us to provide our customers with the quality and reliability needed for the most advanced circuit board designs found in the industry today.