Electro-Mechanical (Packaging) Design Engineer - Orlando, United States - System One

    System One
    System One Orlando, United States

    1 month ago

    System One background
    Description
    System One is seeking a highly qualified Electro-Mechanical (Packaging) Design Engineer for a long-term contract in Orlando, FL.

    Responsibilities:

    Collaborate and drive the Enclosure, Circuit Card, and Harness Interface design of a Vehicle Management Computer replacement from previous Hypersonics IRAD.

    Function as the Environmental Liaison, designing for best practice, yet volume constrained design and working with the Structural, Thermal, and EMI analysts to assure design is capable.

    Responsible for working with PWB suppliers, component engineers, and Manufacturing and Quality Engineering to assure design is manufacturable, yieldable, and affordable.

    Coordinate with overall Glider concurrent engineering and Program management to assure that VMC2.0 can be securely placed on frame as well as inclusion of future Sensors and Data Links.

    Immediate need for 2024 is to get to a VMC2.0 CDR by year end.

    Approved Concept Design has been conducted, but program needs to finish path to full implementation design as well as support HWIL integration and quick path to DVT and early Flight testing in 2026.


    Qualifications:
    Candidates must have at least 6 years of experience with the following: PWB/CCA and Harness design experience.
    Creo
    Windchill
    Circuit Card, and Harness Interface design

    Candidates must be local to the Orlando, FL site.
    Must be able to obtain Secret Clearance. Not needed to start.
    Hypersonic experience is desired.

    #M1