Sr Principal HW IPT Lead - BWI Airport, United States - Northrop Grumman

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.

Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.

We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way.

Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible.

Our employees are not only part of history, they're making history.

Job Description

The Northrop Grumman Mission Systems (NGMS) Advanced Processing Solutions (APS) Business pushes the boundaries of innovation, redefines the leading edge of exotic new technologies, and drives advances in the sciences.

One of our most challenging new fields is Transformational Computing, which combines the unique properties of superconductivity and quantum mechanics to develop radical, new energy-efficient computing systems.

Our team is chartered with providing the skills to transform computing beyond Moore's Law, advancing development of computer architectures, processing/memory subsystems, and large-scale high-performance computing systems.

You'll work in a fast-paced team environment alongside a broad array of scientists and engineers to make these processing solutions a reality and deliver remarkable new advantages to the warfighter.

The Network Information Solutions (NIS) APS sector is seeking an Integrated Product Team (IPT) Lead to join our team of qualified, diverse individuals.

As an IPT Lead you will be responsible for the execution of various design efforts, such as microelectronics packaging design and analysis, cryogenic component design, and other related efforts.

An IPT Lead interfaces with a multidisciplinary set of team members and subject matter experts on the program to best understand the desired product.

In this role, you will direct and be responsible for fielding new requests, driving existing design projects, and delivering fully qualified hardware to an end user.

You must be comfortable being held accountable to aggressive schedules and working in environments with ever-changing requirements. You will also be required to provide regular updates to technical stakeholders and program managers. Candidates must be able to obtain and maintain a TS/SCI clearance requiring a polygraph.

This position requires work onsite at either our Advanced Technologies Laboratory located in the Linthicum, MD area or the building located in Annapolis Junction, MD.

Roles and Responsibilities:

Lead and direct engineering teams during request, design, manufacturing, and delivery phases of products in prototype and volume deployment stages.

Develop and drive technical project schedules and budgets, facilitating overall technical execution for 5-15 different projects.

Brief internal and customer stakeholders on project updates

Develop and shape technical requirements for hardware design projects based on inputs and requests from stakeholders and discipline leads.

Manage projects supported by cross-functional engineering teams, including mechanical, thermal, structural, electrical, and physics/science.


Basic Qualifications:

Bachelor's degree in a STEM related field (engineering or science subject area) with 9+ years of experience in engineering or related area, Master's Degree with 7+ years of experience, or PhD with 4+ years of post-doctorate experience.

4+ years of design or simulation experience in a hardware relevant engineering discipline (mechanical, thermal, structural, electrical, etc.).

2+ years of engineering leadership experience in a team environment.

Effective verbal and written communication, ability to work in a team environment.

Must be able to obtain a TS/SCI clearance with polygraph; U.S Citizenship is a prerequisite.


Preferred Qualifications:
Experience with electronics packaging and cabling.

Experience with cryogenic systems.

Experience with SolidWorks, NX or other 3D modeling software.

Active DOD TS/SCI with polygraph clearance.


Salary Range:
$127,000 - $190,600

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Employees may be eligible for a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives.

In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is committed to hiring and retaining a diverse workforce.

We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.

For our complete EEO/AA and Pay Transparency statement, please visit . U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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