General Engineering Application - Baltimore, MD, United States - Northrop Grumman

Description

Category:
Engineering


Clearance Type:
Interim Secret
Shift: 1st Shift (United States of America)

Travel Required:
Yes, 10% of the Time

Relocation Assistance:
Relocation assistance may be available

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come.

Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible.

NGMS engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies.

Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to work to accomplish the mission while learning and having fun along the way.

The Airborne Multifunction Sensors Engineering and Sciences (AMS E&S) organization is fertile ground for all experience levels to become part of our growing team and contribute to our goals.

The department offers opportunities to grow on a technical track both broad and deep as well as explore project leadership or management positions.

AMS E&S is seeking engineers with experience and interest in electronic assembly and packaging design including:
Managing RF budgets, frequency planning, and common assembly level interfaces
Predicting assembly level performance through selecting materials, components, and packaging approaches, RF chain analysis, electromagnetic simulation, data collection and analysis, and other modeling techniques
Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements
Collaborating with peer functions such as Mechanical, Manufacturing, Quality, Supply Chain, and Test
Utilizing world class manufacturing capabilities both on-site and within the broader company for prototyping through full rate production from the foundry level to microelectronic packaging to printed circuit board fabrication and assembly to subsystem level integration and test
Working directly with a wide variety of different external supplier partners including leading domestic foundries, printed circuit board fabricators and assemblers, component manufacturers, material fabricators, and more

The area is rich with historical sites, museums, concerts and performing arts venues, one of the nation's top medical facilities, college and professional sports, nightlife, and many outdoor activities most notably boating and fishing on the Chesapeake Bay.

The Linthicum campus includes the potential to live in urban, suburban, and waterfront communities within easy commutes and is conveniently located adjacent to the BWI International Airport and an Amtrak rail station.

Electrical Engineering or related STEM field degree: Bachelor of Science with 5 years of RF/microwave experience; or PhD degree
Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty.

Developing subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to:
RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. Proven knowledge of electrical engineering design software and equipment
Must obtain interim secret (minimum) prior to starting


Senior Principal Engineer Basic Qualifications:
Electrical Engineering or related STEM field degree: Bachelor of Science with 9 years of RF/microwave experience; PhD degree with 4 years of experience
Ability to develop solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty which require the regular use of ingenuity and creativity
Established subject matter expertise in one or more areas of RF/Microwave discipline including but not limited to: RF components & assemblies, requirements development, EM and related modeling & simulation, RF test verification, production test support, and design for producibility
Exhibit expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (i.e. Proven knowledge of electrical engineering design software and equipment
Ability to design, implement, install and maintain electrical systems
Must obtain interim secret (minimum) prior to starting
Preferred Qualifications for both Principal and Senior Principal roles:
Secret or Top Secret / SCI security clearance
RF and mixed signal printed circuit board and circuit card assembly level design
RF budgeting, frequency planning, RF chain analysis and modeling, schematic capture, electromagnetic simulation, signal integrity analysis
Ceramic and organic printed circuit board materials, design, fabrication, and assembly processes
RF lab equipment such as network analyzers, spectrum analyzers, signal generators, power meters, etc.
Electronic troubleshooting from component to assembly levels
Complex data reduction and analysis

Software tools:
Mentor Xpedition DX Designer, ANSYS HFSS, Keysight ADS, Keysight Genesys, MathWorks MATLAB, Autodesk AutoCAD, and Microsoft Office Suite (Excel, PowerPoint, Project, Word)
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date.