- BS and 3+ years of relevant industry experience.
- Shown training in mechanics and materials science and experience of experimental mechanics and material characterization.
- Shown capability of setting up equipment and data acquisition systems.
- Hands-on experience of major material analysis and failure analysis tools (e.g., SEM, EDX, FIB, CSAM, etc.) is helpful.
- Familiar with numerical simulation software tools and confident in programming of MATLAB and/or Scientific Python.
- Knowledge of electronic packaging structures, processes and the reliability of electronic packages, package qualification requirements as well as its materials (solders, polymers, etc.) and their mechanical behaviors.
- Able to perform independent research and development work.
- Excellent written and verbal communication skills with ability to present ideas, data, and plans with high confidence at team meetings.
- Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.
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Apple Santa Clara, United StatesIC Packaging Engineer, Characterization and Simulation · Santa Clara,California,United States · Hardware · Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for precision to work towards an extra ...
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IC Packaging Engineer, Characterization and Simulation - Santa Clara, United States - Apple
Description
SummaryPosted: Jan 31, 2024
Role Number:
Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for precision to work towards an extraordinary result? We are looking for a dedicated and hardworking IC Packaging Characterization Engineer to join our team As part of the Packaging team, you will focus on the characterization of Integrated Circuit (IC) packages and related materials. You will also be responsible for developing methodologies of IC packaging characterization, and trouble-shooting IC packaging-related yield and reliability issues.
Description
- Characterizing component packages under various environmental and reliability testing conditions, such as mechanical loading, thermal and moisture stressing. - Characterizing key packaging materials and supervising material characterization activities at suppliers. - Developing characterization methodologies for IC packages and related materials, including setting up equipment and building proper fixtures for the test. - Working on trouble-shooting activities of packaging-related failures.
Key Qualifications
- BS and 3+ years of relevant industry experience.
Additional Requirements
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900 and $256,500, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
IC Packaging Engineer, Characterization and Simulation professionals in Santa Clara
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Gary Hsieh
GARY HSIEH - Business Development Director