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    Principal Engineer, Mechanical Simulation - San Jose, United States - Conductor

    Conductor
    Conductor San Jose, United States

    4 weeks ago

    Default job background
    Description
    What You'll Do


    The Mechanical Simulation Engineer for semiconductor packaging will provide simulation results to analyze the design, consult concerning packaging problems and improvements in the package design, and also respond to customer / client requests or events at they occur.

    Mission of SAMSUNG AVP (Advanced Packaging) is to find package solutions beyond Silicon to make next performance systems considering power and cost and to tackle the difficult and hugely innovative task with the industry.


    You will work very closely with customers from initial design concept to high volume manufacturing, with transparency, exceptionally flawless execution while delivering highest quality product.


    Location :
    Onsite at our San Jose headquarters 5 days a weekwith an average of 10% travel per month

    Responsible for the mechanical design, analysis, and development of electronic packages.

    Strong understanding in mechanics of materials and solid mechanics

    Continuous proven experience in static and dynamic finite element analysis

    Profound knowledge in fundamentals of FEM and different mesh techniques

    Provide mechanical analysis and design support for advanced packaging.

    Conduct DOEs to perform sensitivity analysis with optimal design solutions


    Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.

    Analyze simulation and measurement results to enhance product reliability.

    Work with product engineering and system engineering to debug and improve product yield.

    Complete other responsibilities as assigned.

    What You Bring


    Bachelor's Degree in Mechanical Engineering or related Physical Science with 20+ years of experience or Masters in Mechanical Engineering or related Physical Science with 18+ Years of Industry Experience or PhD in Mechanical Engineering or related Physical Science with 15+ yrs of Industry Experience Preferred.

    More than 5+ years of experience in mechanical and thermal analysis and design in the field of electronic packaging.

    Experience with metals, composites and polymeric material behavior and failure mechanisms


    Experience in the use of finite element analysis tools such as ANSYS, ABAQUS, LS-DYNA to analyze, debug, and propose design solutions for various electronic packaging issues observed during assembly, reliability and operation.

    Knowledge of thermal behavior analysis and optimization of electrical devices

    Experience with script language such as python, perl, and MATLAB

    You're inclusive, adapting your style to the situation and diverse global norms of our people.

    An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.

    You're collaborative, building relationships, humbly offering support and openly welcoming approaches.

    Innovative and creative, you proactively explore new ideas and adapt quickly to change.

    #Li-MD1

    #J-18808-Ljbffr
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