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    Wafer Fab Process Engineer - Princeton, United States - SRI International

    SRI International
    SRI International Princeton, United States

    5 days ago

    Default job background
    Full time
    Description

    Overview

    At SRI International (formerly Sarnoff Corporation), the Microcircuit Emulation Center in Princeton, NJ, needs a Wafer Fab Process Engineer to support the Plasma Etch process area, supporting the manufacturing of microcircuits (integrated circuits).

    Through SRI's Generalized Emulation of Microcircuits (GEM) and Advanced Microcircuit Emulation (AME) programs, the Microcircuit Emulation Center supplies form, fit, function, and interface replacements for obsolete microcircuits. This capability supports production, redesign, and sustainment requirements for the life of a weapon system. SRI's Microcircuit Emulation Center is a government-supported, U.S.-based Trusted foundry.

    Responsibilities

    The successful candidate will be an experienced Plasma Etch process engineer in the semiconductor industry and responsibilities will include:

  • Hands-on process engineering experience to support low-volume, high-product mix microcircuit manufacturing and development
  • Sustaining, improving, and optimizing current processes to support operations
  • Working with process engineers to integrate and develop processes for existing and future technologies to enable yield improvement, defect reduction, improved reliability, and future technology development
  • Working in cross functional teams (Integration, Design and Layout, etc.) to address process issues
  • Data collection, correlation, interpretation, and presentation of information to management and co-workers
  • Creating and maintaining operational and safety documentation for all processes and methods being performed
  • Working collaboratively with staff across organization, including Management and Operational engineers

    • Qualifications

  • BS degree in chemistry, physics, material science, or an equivalent field
  • Wafer Fab processing engineering experience in Plasma Etch process area is required (minimum 3 years)
  • Demonstrated analytical and systematic teamwork approach to troubleshooting
  • Due to Government requirements candidates must be a US Citizen or Permanent Resident

    • Other Requirements

  • Experience working with Lam and/or Applied Materials systems is desired
  • Process integration knowledge and experience is advantageous
  • Computer programming skills are desired
  • Must be able to communicate with people at all levels in the organization
  • Be a self-starter with great attention to detail and strong organizational skills

    • Working Conditions

  • Working in a clean room environment for a significant part of the workday
  • Performing flexible shift work when required

    • The salary range is: $75,258-$99,720. Salary ranges will vary and are based on several factors, including geographic location, market competitiveness and equity amongst internal employees in similar roles. Positions may also qualify for SRI's Pay for Outstanding Performance program or the annual Performance Based Compensation program. SRI also has a competitive benefits package

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