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- Responsible for conducting failure analysis needed to identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
- Good communication skills, work well with a team, deliver under pressure, and well organized.
- Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, LabVIEW and SEM imaging on printed circuit boards are preferred.
Computer Technician - Phoenix, United States - Compunnel Inc.
Description
Required Skills: