Senior RDA Engineer, APTD - Boise

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, · inspiring the world to learn, communicate and advance faster than ever. · ...

The Staff RDA Engineer will review and analyze experimental process flows, looking for defect anomalies and quarantining process tools that are out of control. · Use inline process signals to drive process improvements. · ...

We are seeking an engineer who is passionate about creative problem solving and finding innovative solutions to join our Advanced Packaging Technology Development (APTD) department. · The ideal candidate will have experience with semiconductor fabrication techniques and data scie ...

We're seeking an engineer who is passionate about creative problem solving and finding innovative solutions. · ...

Job summary · As a Realtime Defect Analysis (RDA) Technology Development Engineer in APTD, you will learn how to use pioneering defect detection equipment and processes to solve issues and drive improvement. · ...

We are seeking a Staff Metrology Engineer to create develop and optimize Assembly Stacking wafer level packaging defect detection and metrology methods to develop next generation products. · ​​Identify diagnose and resolve defect and metrology-related problems by applying failure ...

Micron Technology is seeking a Realtime Defect Analysis (RDA) Technology Development Engineer in their Advanced Packaging Technology Development (APTD) department. · We're a world leader in innovating memory and storage solutions that accelerate the transformation of information ...

Staff Metrology Engineer to drive product quality, yield improvements, cost reduction, productivity and risk management. · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

Drive product quality, yield improvements, cost reduction and productivity as well as resolve manufacturing line problems Coordinate and carry out sensitivity evaluation to implement changes at process step Lead yield improvement activities Manage equipment suppliers to achieve q ...

We are seeking a Staff Process Integration Engineer to join our Advanced Packaging Technology Development (APTD) team at Micron Technology. · ...

We are seeking a Principal Process Engineer to join our Advanced Packaging Technology Development (APTD) department. As a key member of our team, you will be responsible for starting up, developing and optimizing processes to improve product quality and reliability. · Identify, d ...

We are seeking a Principal Process Engineer to join our Advanced Packaging Technology Development (APTD) department at Micron Technology. As a key member of our team, you will be responsible for starting up, developing and optimizing processes to improve product quality and relia ...

Micron Technology is seeking an MTS Process Integration Engineer for its Advanced Packaging Technology Development (APTD) department. The ideal candidate will own the end-to-end integration of next generation package architectures like 2.5D, 3D stacking, HBM memory integration an ...

Own package-level process integration across 2.5D/3D flows wafer-to-wafer chip-to-wafer advanced interconnects defining specs and process windows that meet high performance targets for HPC/AI products · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, · inspiring the world to learn, communicate and advance faster than ever. · ...

Micron Technology is seeking an Advanced Packing Process Development (APTD) Intern to join our groundbreaking Technology Development organization in Boise. As an integral part of this team, you will contribute to developing next-generation packaging solutions for high-performance ...

We are transforming how the world uses information to enrich life for all. · Micron Technology is a global leader in memory and storage innovation,The Advanced Packaging team is focused on developing next-generation packaging solutions that enable high-performance,You will be res ...

We are seeking an experienced Design Engineer to join our TSV Packaging team. High-performance memory devices like HBM, RDIMM/LRDIMM and CAMM modules graphics GDDR packages and other Micron architectures require extensive engineering analysis and design to meet the mechanical req ...