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- Experience in wirebonding and ribbon bonding and wire and various sizes of ribbon)
- Ability to work 10 hours under a microscope and utilize hand tools such as torque drivers, tweezers and other similar tools
- Good dexterity and eye/hand coordination
- Experience in microelectronics assembly (chip and wire assembly)
- Ability to read and work from detailed work instructions and drawings; computer skills are required to support retrieval of drawings and work instructions
- Active Secret or Previously held Secret required Responsibilities:
- Performs fabrication or modification tasks on RF Microwave hybrid microcircuits and sub-assemblies.
- Performing gold wire bonding using manual and automated 0.001 and machines and ribbon bonding to duroid and ceramic substrates, capacitors, resistors, diodes, spirals and other microelectronic components.
- Wirebonding onto small pad sizes down to 0.001 in assemblies with very high semiconductor chip density and unusual substrate configurations which require special setup and bonding techniques.
- Troubleshoot defective hybrids circuit card assemblies by visually screening wirebonds or chip placement.
- Installation of substrates and components in highly complex microwave assemblies using paste and sheet epoxies.
- Utilization of measurement equipment (e.g. reticle, drop indicator, bond puller) to check parameters during and after work completion to assure that the unit conforms to specifications. EOE/ADA
Assembler with Security Clearance - Chelmsford, United States - SRG Government Services
SRG Government Services
Chelmsford, United States
2 weeks ago
Description
Assembler Salary:
Up to $37/hr.
Location:
Chelmsford,MA (fully on-site)
Shift: 4/10, 2nd shift (3 pm - 1:30 am)
Industry:
Government/Defense
Employment Type:
Long-term contract with potential for permanent employment
Clearance:
Active Secret or Previously held Secret clearance required Qualifications: * HSD/GED and 6+ years of relevant experience required.