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- Experience with hands on (preferably 5 years) assembly of photonic systems that include compound semiconductor such as laser, modulators and photodetectors
- Experience working with compound semiconductor device processing
- Ability to work independently with minimal supervision and collaboratively as part of a dynamic, multi-disciplinary team
- Excellent organization and communication skills
- Master's degree in mechanical engineering, materials science, physics, or a related field
Mechanical Engineer with Security Clearance - Lexington, MA, United States - John Galt Staffing
Description
The Quantum Information and Integrated Nanosystems Group seeks an individual interested in packaging of compound semiconductor devices for use in integrated photonic systemsThe candidate will have a hands-on role in the areas of material processing and component assembly
The candidate's responsibilities will include design of assemblies, including thermal and stress analysis where needed, as well as procurement and assembly of parts
The individual will collaborate with a multi-disciplinary team to develop a wide variety of packaging solutions for testing, and/or delivery, of discrete devices or photonic systems including lasers, photodetectors, optical modulators, and passive optical interconnects
Required Qualifications:
Microfabrication techniques (e.g., photolithography, evaporation, sputtering) and process integration
Optoelectronic or RF device testing (e.g
I-V, edge coupling, S-parameters, etc.)
Capital equipment maintenance Clearance:
Candidates should have an active clearance (secret/top secret, etc.) in order to be considered for this position due to the nature of the work being done.