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    Senior Principal Engineer - Palo Alto, United States - SambaNova Systems

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    Description
    The era of pervasive AI has arrived.

    In this era, organizations will use generative AI to unlock hidden value in their data, accelerate processes, reduce costs, drive efficiency and innovation to fundamentally transform their businesses and operations at scale.

    SambaNova SuiteTM is the first full-stack, generative AI platform, from chip to model, optimized for enterprise and government organizations.

    Powered by the intelligent SN40L chip, the SambaNova Suite is a fully integrated platform, delivered on-premises or in the cloud, combined with state-of-the-art open-source models that can be easily and securely fine-tuned using customer data for greater accuracy.

    Once adapted with customer data, customers retain model ownership in perpetuity, so they can turn generative AI into one of their most valuable assets.

    Working at SambaNova


    SambaNova Systems is seeking an experienced and passionate System/Packaging Thermal Engineer / Lead to drive the most advanced system/packaging technology from conception to production.

    Responsibilities

    Pathfinding - establish relationship with foundry, OSAT, material supplier to develop package development roadmap; plan test vehicle when necessary
    Product definition - drive physical architecture through collaboration with system architect for future product
    Product development - manage design process, review thermal, mechanical analysis result, final product sign off.

    New product introduction:

    manage DOEs for initial build and product quality; drive triage effort with partners for any unexpected quality and reliability issue.


    Basic Required Skills/Qualifications:
    MS in Mechanical Engineering, Materials Science, or a similar field
    15+ experience years in thermal design or related field

    Additional Required Skills/Qualifications


    Extensive experience in leading thermal architecture design, modeling, development and testing for custom silicon chips and system solutions (including liquid-cooling, air-cooling ) for enterprise systems.

    Knowledge of advanced packaging manufacturing flows and processes
    Experience with successful package product qualification with large complex package design

    Annual Salary Range and Level

    The base salary for this position ranges from $180,000/year up to $210,000/year.

    This range is based on role, level, and location and reflects the salary target for new hires in the US.

    Individual pay within the range will depend on a number of factors, including a candidate's job-related qualifications, skills, competencies and experience, and location.

    Benefits Summary For US-Based Full-Time Direct Employment Positions

    (The Recruiter will provide benefit details for non-US-based roles)

    SambaNova offers a competitive total rewards package, including the base salary, plus equity and benefits.

    We cover 95% premium coverage for employee medical insurance, and 77% premium coverage for dependents and offer a Health Savings Account (HSA) with employer contribution.

    We also offer Dental, Vision, Short/Long term Disability, Basic Life, Voluntary Life, and AD&D insurance plans in addition to Flexible Spending Account (FSA) options like Health Care, Limited Purpose, and Dependent Care.

    Our library of well-being benefits available to you and your dependents includes a full subscription to Headspace, Gympass+ membership with access to physical gyms, One Medical membership, counseling services with an Employee Assistance Program, and much more.

    Submission Guidelines


    Please note that in order to be considered an applicant for any position at SambaNova Systems, you must submit an application form for each position for which you believe you are qualified.


    If you are a new, recent (within the last two years), or upcoming college graduate and are interested in opportunities with SambaNova Systems, please apply through our university job listings.

    EEO Policy

    SambaNova Systems is an Equal Opportunity/Affirmative Action Employer.

    All qualified applicants will receive consideration for employment without regard basis of age (40 and over), color, disability, gender identity, genetic information, marital status, military or veteran status, national origin/ancestry, race, religion, creed, sex (including pregnancy, childbirth, breastfeeding), sexual orientation, and any other applicable status protected by federal, state, or local laws.

    Customers turn to SambaNova to quickly deploy state-of-the-art generative AI capabilities within the enterprise. Our purpose-built enterprise-scale AI platform is the technology backbone for the next generation of AI computing.


    Headquartered in Palo Alto, California, SambaNova Systems was founded in 2017 by industry luminaries, and hardware and software design experts from Sun/Oracle and Stanford University.

    Investors include SoftBank Vision Fund 2, funds and accounts managed by BlackRock, Intel Capital, GV, Walden International, Temasek, GIC, Redline Capital, Atlantic Bridge Ventures, Celesta, and several others.

    Visit us at Follow SambaNova Systems on Linkedin.
    #J-18808-Ljbffr

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