Senior Product Manager – Advanced Packaging - Santa Clara, CA

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · Collaborate with IC design teams to support package planning and substrate design. · Build and correlate SI/PI models for advanced interconnec ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.  · At Marvell, you can aff ...

MediaTech is seeking a talented and experienced technical leader with expertise in Packaging Architect. · This role involves close collaboration with cross-functional teams. · ...

About the role involves close collaboration with cross-functional teams to develop innovative packaging solutions for automotive and computing applications. · ...

We are looking for an expert, highly experienced Senior FEA Engineer to join our Advanced Packaging Modeling team in Santa Clara, CA. · Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor package ...

+who we areapplied materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world as the foundation of the global electronics industry applied enables the exciting technologies that literally connect our ...

We're looking for an experienced packaging engineer to join our team at Google. In this role, you'll work on shaping the future of AI/ML hardware acceleration by driving cutting-edge TPU technology. · ...

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver indust ...

Shape the future of AI/ML hardware acceleration and contribute to the innovation behind products loved by millions worldwide. · Develop advanced packaging solutions for ML chips. · Collaborate with architects to create high-performance packages optimized for electrical performanc ...

+Job summary · In this role you'll work to shape the future of AI/ML hardware acceleration + · +Develop next-generation packaging breakthroughs and qualify high-performance foundry solutions. · Drive the development of advanced test macro features and execute engineering plans fo ...

In this role, you'll work to shape the future of AI/ML hardware acceleration. · You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers Google's most demanding AI/ML applications. · ...

Coordinate the management and spend of AMD's strategic foundry suppliers with specific focus on post fab / advanced packaging services.In this role you will develop the global procurement strategy for foundry with specific focus on post fab and advanced packaging; implementing a ...

The Advanced Packaging Yield & Data Engineer will play a critical role in driving yield improvement, data analytics, and process optimization across advanced packaging technologies for co-packaged optics products. · ...

Piper Companies is seeking an Advanced Packaging Engineer to support a leading organization in the semiconductor and high‑performance hardware industry. The Advanced Packaging Engineer role is ideal for an experienced engineer with strong expertise in organic substrate technologi ...

Who We Are · Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chip ...

The Advanced Packaging Yield & Data Engineer will play a critical role in driving yield improvement, data analytics, and process optimization across advanced packaging technologies for co-packaged optics products. · This position blends domain expertise in semiconductor and optic ...

The Advanced Packaging Yield and Data Engineer will play a critical role in driving yield improvement, data analytics, and process optimization across advanced packaging technologies for co-packaged optics products. · ...

Piper Companies is seeking an Advanced Packaging Engineer to support a leading organization in the semiconductor and high‑performance computing industry. The Advanced Packaging Engineer will play a critical role in next‑generation single‑chip, SoC, and multi‑component module pack ...

Who We Are · Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chip ...

As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, · advanced custom package solutions achieving ...