Process Engineer - Apopka, United States - Engineered Staffing Solutions

Description

At a forefront of distributed and specialty electronic components for military, space, medical, and industrial applications, our client provides comprehensive solutions underpinned by reliability and innovation. With over 35 years of experience, we offer a spectrum of services from die processing to custom packaging and interconnect solutions, ensuring end-to-end support for diverse applications.

Core Responsibilities:

• Lead process technology transfers from Process Engineering department to Manufacturing department
• Provide operator training and validate competency to perform required tasks
• Develop robust production processes using Design of Experiments (DOEs)
• Estimate manufacturing costs, determine time standards, and make recommendations for tooling and process requirements of new and existing products
• Establish validation and verification criteria for new processes & products
• Create and revise documentation detailing production processes
• Take the lead to provide engineering support to facilitate production processes
• Take an active role in the troubleshooting of problems in assembly areas working toward root cause and corrective action (RCCA) processes
• Stay abreast of best practices and technologies and provide input on new processes to enhance or expand capabilities
• Interface with Design Engineering team regarding process capabilities, materials, and review new products to ensure they meet Design for Manufacturing (DFM) criteria
• Identify, facilitate, and prioritize opportunities for process improvements

Qualifications:

• BSME or combined education and experience
• 7-10 years of related manufacturing experience
• Working knowledge of MIL, IPC, and J-STD workmanship, qualification and performance standards
• Working knowledge of parallel seam welding processes associated of Hermetic device manufacturing
• Understanding of environmental screening requirements associated with micro-electronic assemblies
• Experience with Wire bond and die attach of Hybrid Products.
• Fast technical document generation/modification CAD, Excel, (PCB software is a plus).
• Design tool/fixtures with minimal guidance.
• SMT Process development in both leaded and lead-free assemblies.
• Knowledge in semiconductor manufacturing.