IC Packaging Engineer - San Jose, United States - Power Integrations

Description

Description

Job Description

• Responsible for defining substrate/package design rules, process flow and material set for new automotive power module packages
• Drive alignment between module substrate (PCB) design requirements and supplier capabilities, to enable new product development and volume manufacturing of power modules
• Develop new assembly technologies, run process DOE's, to define process windows for new package development
• Drive reliability testing and qualification of new automotive module packages in conjunction with the reliability group
• Work closely with offshore assembly and substrate partners to develop new processes
• Work closely with IC design teams to define package design rules and define packages to meet their requirements
• Collaborate with multi-functional teams within Power Integrations for successful development, qualification and production ramp of new module products

Job Requirements

• BS Degree in Electrical Engineering, Mechanical Engineering, Material Science.
• Minimum experience 8 years in semiconductor packaging technology.
• Experience leaded multi-die packages.
• Understanding of organic laminate technologies manufacturing and supplier capabilities.
• Experience in SMT or passive integrated package assembly is a plus.
• Experience with packaging processes: Wafer Back-grinding, Wafer Dicing, Die Attach, Wire-bonding, Molding, and Package Singulation. (Flip Chip is a plus)
• Experience with package substrate design rules, tools (including AutoCAD).
• Knowledge of AEQ Automotive reliability requirements.
• Knowledge of APQP automotive development process
• Knowledge of JEDEC/IPC design standards.
• Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout a plus.
• Travel to Asia to attend technology reviews and resolve subcon/supplier issues

Pay: to $150K commensurate with experience