IFS Roadmap Device and TCAD Engineer - Hillsboro, United States - Intel

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Job Details:
Job Description: Do Something Wonderful Intel put the Silicon in Silicon Valley. No one else is this obsessed with engineering a brighter future. Every day, we create world changing technology that enriches the lives of every person on earth. So, if you have a big idea, lets do something wonderful together. Join us, because at Intel, we are building a better tomorrow.

Want to learn more? Visit our YouTube Channel or the links belowLife at IntelDiversity at IntelAs an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services IFS, a fully vertical, standalone foundry business, reporting directly to the CEO.

IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally.

Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - available for customers globally - and a world-class IP portfolio that customers can choose from including x86 cores, graphics, media, display, AI, interconnect, fabric, and other critical foundational IP, along with Arm and RISC-V ecosystem IPs.

IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.

This business unit is dedicated to the success of its customers with full P and L responsibilities.

This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement and capacity commitments.

IFS is already engaged with customers today starting with our existing foundry offerings and we are expanding imminently to include our most advanced technologies, which are optimized for cutting-edge performance, making them ideal for high-performance applications.

The selected candidate for the IFS Roadmap Device and TCAD Engineer position will be responsible for but not limited to:

Create next generation device and interconnect technology by ensuring the process device performance for developing processes is world class, using deep understanding of device physics.

Drive TCAD models and device development for advanced logic and analog designs.
Use TCAD to enable predictive analysis of advanced FINFET, GAA, DMOS transistor and interconnect technologies.

Directly interact with device, design, and process teams to develop tools and methodologies to drive Design-Technology Co-Optimization (DTCO).Identify device requirements in the leading-edge logic technologies offered by IFS and provide improvement solutions that meets customer needs.

Evaluate device performance data, using statistics, data mining, and other data analysis techniques to collect, explore and extract insights from electrical-test and process yield data.

Develop scripts, algorithms and applications to translate experimental data into intelligence in order to define future development direction.
Assess silicon-to-simulation health and readiness for high volume manufacturing.

The ideal candidate should exhibit the following behavioral traits:

Service mindset with a focus on quality solutions, drive velocity of execution and thrive in solving complex problems for foundry customers.

Skills with collaborations across multiple internal/external teams.
Strong communication and presentation skills to management.


Qualifications:
What we need to see (Minimum Qualifications):Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Masters degree in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, or related field with 4+ years of experience OR a Ph.

D.

in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering, or related field with 2+ years of experience.2+ years of experience with Device simulation tools such as Synopsys Sentaurus, Coventor SEMulator, or Silvaco Victory.2+ years of experience using Synopsys Copter or another device model optimization tool4+ years of experience with Process integration and device physics.

How to Stand out (Preferred Qualifications):
Strong understanding of device physics, quality and reliability techniques and trade-offs.
Ability to be customer focused and obsessed in driving technical engagements and meeting project milestones with high quality. Demonstrate the ability to mitigate risk and drive project execution to meet customer schedule commitments.
Experience working with multiple foundry technologies is a plus.
In-depth knowledge /experience with Intel technology is a strong plus.
Demonstrate evidence of organizational and planning skills for technology development.
Process technology development and optimization of technology definition using Design-Technology Co-optimization (DTCO) methodology.
Device physics and interconnect technology characterization.
Logic/memory process technologies such as FinFET, GAA, CFET, DMOS.Amazing BenefitsHere at Intel, we invest in our people.

Beyond health, dental, and retirement benefits, Intels benefits package includes 14 paid holidays per calendar year, three weeks of paid vacation, and four-week paid sabbatical every four years of employment.

Intel also offers employees five bonuses per year dependent on overall company and personal performance, and an employee stock purchase program.

Find more information about our Amazing Benefits here:

Job Type:
Experienced HireShift:Shift 1 (United States of America)

Primary Location:
US, California, Santa Clara

Additional Locations:

US, California, Folsom, US, New Mexico, Albuquerque, US, Oregon, Hillsboro, US, Texas, AustinBusiness group:Intel Foundry Services (IFS) is an independent foundry business that is established to meet our customers' unique product needs.

With the first "Open System Foundry" model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient and sustainable source of supply.

Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance

Position of TrustN/ABenefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.

Find more information about all of our Amazing Benefits here:

Annual Salary Range for jobs which could be performed in US, California:$136,750.00-$232,630.00Salary range dependent on a number of factors including location and experience.

Work Model for this RoleThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

In certain circumstances the work model may change to accommodate business needs.


SummaryLocation:
US, California, Santa Clara; US, Oregon, Hillsboro; US, New Mexico, Albuquerque; US, California, Folsom; US, Texas, AustinType: Full time