Senior Package Engineer - Santa Clara - Rapidus Corporation

    Rapidus Corporation
    Rapidus Corporation Santa Clara

    1 day ago

    Description
    • Provide expert technical support for assembly and test development with a focus on advanced chiplet and multi-die packaging.
    • Partner with customers to clarify technical requirements, align specifications, and resolve design and integration issues.
    • Guide interposer design, multi-die integration, and system-level packaging considerations.
    • Collaborate with cross-functional teams across design, development, test, and packaging to overcome technical challenges.
    • Develop and deliver clear, well-structured technical documentation and presentations for both internal stakeholders and customers.

    Scroll down to find the complete details of the job offer, including experience required and associated duties and tasks.

    Required Qualifications

    • Proven hands-on experience in 2.5D / 2.xD / 3D chiplet or multi-die packaging design.
    • Strong knowledge of interposer design and advanced packaging technologies.
    • Familiarity with system-level validation, test methodologies, and productization processes.
    • Demonstrated ability to work directly with customers and collaborate across diverse technical teams.

    Preferred Qualifications

    • Expertise in high-bandwidth interconnects, HBM integration, or multi-chip module design.
    • Understanding of thermal management, signal integrity (SI), and power distribution in advanced packaging. xhmxlyz
    • Experience in customer-facing technical roles and/or technical program management.

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