Muhammad Jamil

I am a mechanical engineer with a strong background in thermal analysis, semiconductor characterization, and hardware validation. With experience in research, simulation, and experimental validation, I have worked extensively on thermal imaging, device characterization, and computational modeling for advanced semiconductor materials.

My expertise includes MATLAB, Python, FEM/FEA, CFD simulations, and ANSYS, which I have applied to analyze heat transfer in GaN HEMTs, GaOx TLMs, and other UWBG devices. I am passionate about hardware validation, product development, and performance optimization, with a keen interest in Silicon Hardware Engineering.

Additionally, my experience in military operations as a power generation specialist has strengthened my problem-solving skills, leadership, and ability to perform under high-pressure environments. I thrive in collaborative, interdisciplinary teams and am eager to contribute to cutting-edge technology development in the semiconductor industry.

I have a diverse professional background spanning research, engineering, and military operations. I am a Research Assistant at the University of Connecticut, where I conduct thermal imaging and characterization of semiconductor devices using Microsanj equipment, improving material characterization accuracy and process validation efficiency. Additionally, I work with Sandia National Laboratories, where I enhance device characterization accuracy for UWBG materials and perform ANSYS simulations of GaN HEMTs and GaOx TLMs.

Beyond research, I serve in the Connecticut Army National Guard as a 91D Power Generation Specialist, ensuring mission-critical power systems remain operational, troubleshooting mechanical and electrical issues, and leading maintenance operations under high-pressure conditions.

My experience also includes conducting environmental impact analysis on military installations as a Research Assistant at William Joiner Institute, where I developed a structured survey methodology to improve data collection accuracy.

With expertise in thermal analysis, mechanical design, semiconductor research, and system optimization, I bring a strong problem-solving mindset, hands-on technical skills, and leadership experience to every role.

I hold a Master’s in Mechanical Engineering from the University of Connecticut (2023–2025), where my research focuses on thermal imaging, semiconductor characterization, and device validation using techniques like Microsanj TTI, GRT, and ANSYS simulations. My work involves analyzing heat transfer in GaN HEMTs and GaOx TLMs, optimizing semiconductor performance, and validating experimental results.

I also earned a Bachelor’s in Mechanical Engineering from the University of Connecticut (2019–2023), where I built a strong foundation in thermal analysis, computational modeling (FEM/FEA, CFD), and hardware design. My coursework and projects emphasized semiconductor physics, materials science, and system optimization, aligning with hardware validation, product development, and silicon engineering roles.