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Cheng-Yen Wu

Cheng-Yen Wu

R&D / Process / Materials / Mechanical Engineering
Los Angeles, Los Angeles

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About Cheng-Yen Wu:

Dedicated Materials Engineering graduate student with focus on Machine Learning & Data Science at USC. I possess strong backgrounds in Materials Science, Mechanical Engineering, CAD Design, DOE(Design of Experiment) and Data Analysis. Previously served as an undergraduate researcher at the Nano Device & Energy Material Lab at National Central University, Taiwan, and R&D Intern at DuPont's EP Lab, gaining hands-on experience in lab-based 2D semiconductor materials and PCB plating research, and leading R&D projects.

Areas of Expertise:

- Programming skills: Python, C++/C, C#

- CAD Design: SolidWorks, AutoCAD, AutoCAD Inventor, KISSsys, KISSsoft

- Simulation/Analysis/DOE: Adams, Ansys, MATLAB, LabVIEW, Minitab

Keywords: R&D, DOE, Process Integration, IC Substrate, electroplating, semiconductor, Python, Machine Learning, Data Science, CAD Design

Experience


R&D Intern | RD EP Lab @ DuPont, Jul 2021 - Jun 2022 

DuPont is developing materials for our customers (B2B) to produce electronic devices. Our material performance is not only determined by the material itself, but also coupled with plating tool capabilities. However, our lab tool limits the material's performance window, and made the product promotion more difficult, where I expanded the toolbox to improve our tool.

Project: PCB Copper Plating Uniformity Improvement Project

- Brainstormed/studied possible factors affecting lab-based PCB copper plating and performed DOE to test/verify their contributions and relations to plating uniformity with assist of Ishikawa Diagram and Minitab

- Considered and analyzed all test results to establish new generation plating tools for demoing DuPont’s product with assist of Ansys, Minitab and MS Excel

- Upgraded DuPont’s plating tool to satisfy all customers' CTQ by using AutoCAD Inventor and SolidWorks

- Successfully improved the plating performance by 33%

- Translated into the further engagement with DuPont’s customers to bring a potential $4.66-million-USD business in 2023

- 2nd Place, DuPont Taiwan Summer Intern Final Competition

Education

National Central University, Taiwan: BS in Mechanical Engineering - Design and Analysis Engineering

University of Southern California: MS in Materials Engineering - Machine Learning

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